2 struggles to dissipate the attendant heat using straight conduction cooling. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. Highly versatile and multifunctional, the unit supports a large variety of COTS modules, including: Fully. The XChange3031 delivers full wire-speed across all of its ports and supports jumbo frames up to 10 kB. conduction cooling. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. Rugged Design Kit for development of 3U conduction-cooled VPX single board<br /> computers. 3U VPX 40G Ethernet Switch | Layer 2 Switching Conduction-cooled 3U VPX Ethernet switch module. 8” pitch. of air cooled VPX plug-in units Improve the cooling of VITA 48. 4mm; Weight: To be Announced;Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. VITA 67. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. 1-2201-compliant conduction-cooled 3UVPX carrier card . It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. Accommodating cooling methods that include forced air, conduction, and liquid. The high-density components that enable high-speed I/O also use more power, making advanced cooling methods essential for rugged VPX designs. However, as module power continues to increase, VITA 48. Designed to meet the requirements of VITA 62 for use in harsh environments. 0 standard by specifying additional mechanical details related to the frame construction of conduction-cooled modules. 3V auxiliary Parallel operation capable with proprietary wireless. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. A brief low intensity electric current is applied to individual nerves, with recording. 0 in. 3U Switch. 125 Gb/sec. This highly ruggedized conduction cooled unit provides a versatile multifunction clock references for any environment. Up to. Today ATR’s are introduced into applications imagined never before, including surveillance, data collection, storage and weapons control. ANSI/VITA Stabilized Maintenance. It’s hybrid cooling design stretches the cooling capabilities in equipment built with readily available VPX, VITA 48. The Condor GR4-RTX3000 is a rugged 3U VPX form factor card based on NVIDIA® Turing™ architecture and the NVIDIA RTX™ platform. Combine various standard components to create a Wedge Lok that satisfies your requirements. VPX plug-in LFT modules use liquid flowing through an integral heatsink of the module for cooling the circuit board. It can operate up to 85 °C card edge temperature according to VITA 47 Product Features. 3 Up to 24x 10 GETH. 4. slots support conduction-cooled 3U VPX, 3U cPCI, or power supply modules. 0 in. 0 in. The modules can be easily tailored to suit individual requirements, VPX Test Adapter. 0 Serial: 2 RS-232/422/485 SATA: 4. 0) is a widely adopted VPX-based standard which builds on the great success VME systems have had in this arena. 6 Gigabit Ethernet Control Plane on VPX VITA 46. The IC-INT-VPX3e is a powerful OpenVPX 3U Single Board Computer (SBC) based on the Broadwell-DE processor – 14nm High Performance Chip of Intel’s Low Power Spectrum. 87"W x 3. Configure your PCB Wedge Lok. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. It is available in air. FREMONT, Calif. The up to 800 Watt power output true 6. conduction or air-cooled modules. 2-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. The XChange3030 delivers full wire-speed across all. Groove Width: 12. Power Supplies. The chassis is cold plate base coupled conduction cooled. Material:. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. Clear all Compare. 2) where keying as defined in the VME64 Extensions standard cannot be applied. pitch conduction-cooled VPX (VITA 48. AVC-VPX. AFT relies on a heat frame that clamshells onto the entire board’s electronics. 2 Type 2, Secondary Side Retainer. View product Compare. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. 0 in. Table 1 below shows the significant increase in board power consumption over. Up to 20 CFM of airflow is provided per slot. 2 conduction cooled 6U VPX module with 1 inch pitch : • 6Ux160mm form factor as defined by IEEE 1101. The VPX base standard defined in VITA 46 is a scalable module and backplane technology designed specifically for high speed, critical embedded systems. Block Diagram. 0 in. 1) modules. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. Reconfigurable. Development chassis for VPX and SOSA aligned module payloads. The WILDSTAR 3XV7 integrates Xilinx's new Versal™ Premium VP1502 or VP1702 FPGA. 0 and VITA 65 connector interoperability. The PMC-1553 is the Only Commercial Off the Shelf (COTS) Card that Passes and Executes the SAE AS4111/4112. Trident offers a wide range of ATR chassis that are convection, conduction cooled, forced air conduction cooled and liquid cooled. 3U VPX Board - 1 x8, 2 x4, 4 x2 PCIe. 1 * Kintex® UltraScale™ FPGA. The Intel® Xeon® D processor can provide up to 16 Xeon®-class cores in a single, power-efficient System-on-Chip (SoC) package. ENHANCE THE PERFORMANCE & RELIABILITY OF YOUR SYSTEM WITH ONE DESIGN DECISION. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. 30 in. 3U Conduction cooled models available in 1″ form factor. FPGA Family. Integrated security features for reliable, secure data transmission. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling and to an attached cold plate by conduction cooling. Contact Us. Learn more about this product below »Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. or 1. High Performance Embedded Computing. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. Air-cooled models include an additional 10/100/1000Base-T port available on the front panel RJ45 connector. Standard heatframe components provided represent a high<br /> performance Thermo-Mechanical design, and reduces engineering and<br /> fabrication costs associated with customization. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. The chassis can accept a front and a rear module. Convection (air) and conduction with extended temps. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. 97"H Chassis Cooling: Conduction-Cooled, Natural Convection-Cooled. The chassis is designed for plug in cards in alignment with the SOSA technical standard. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. It supports up to two 0. Revolutionary design allows for up to 175 watts per slot of conduction cooling. Operating Temperature Range Storage Temperature Range; Min Max Min Max; AC1: Air Cooled Industrial-40°C +70°C-55°C +100°C: CC1: Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2FPGA, 19 Zoll, Nvidia Jetson, CPCI, VPX air cooled, VPX conduction cooled, MicroTCA, Ip-Core, and NVME SSD Locations Primary Industriestraße 10. The 3U VPX form factor is compatible with several VITA standards including: VITA-46, VITA-48 and VITA-65. 3 V. 1. 6GHz Thirty-two. The LoC-600 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VITA 48. 3 V @ 9 mA to 60 mA) Conduction Cooled: MMCX Jack (+3. 2 conduction cooled or VITA 48. 8" conduction cooled VPX power supplies, built to satisfy the most challenging application requirements while providing up. Also available: 3U VPX HOST SIDE Bus Extention Adapter PCIe Gen. Level 1-5 Air, Conduction Cooled. Reviews aren't verified, but Google checks for and removes fake content when it's identified. It defines a keying system that can be added to VME64x boards and backplanes in a conduction cooled environment (IEEE 1101. 4 mm Compliant with the VITA 78 SpaceVPX standard For lab variant: Air-cooled metals For flight variant: Conduction-cooled metals Up to 12 Rx/Tx mid-board fiber transceivers System Manager FPGA For lab variant: ACT-H3KI-CG624: ProASIC3: A3PE3000-2FG896iPCI-SYSTEMS Inc. VPX™ interface- OpenVPX™ VITA 65 MOD3-PAY-2F2T-16. Kontron's selection of VPX switches includes fully managed 10 Gigabit Ethernet switching and up to 28 ports Gigabit Ethernet switching. 85" or 1. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. A comprehensive 3U VPX product portfolio of PICs aligned with CMOSS and SOSA technical standards such as SDR, DSP, SBC, networking, communication, and PNT. 6U VPX Load Board Forced Air-Cooled Enclosure Two-Slot OpenVPX Development Platform IPv4/IPv6 Gigabit Ethernet Switch 4 0 On the Cover. A momentary push button is provided for reset, and a switch is. Talk to a Hartmann representative today about compliance and your power needs. 950 inch Standard Conduction Cooled VITA Card in SOLIDWORKS. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). 3U VPX-REDI conduction-cooled form factor; Dimensions: 100 mm x 160 mm; 0. Metal frames under the electronics that serve as heat spreaders to move heat to the card edge; Card retainer clamp/wedge lock to mechanically and thermally attach the card to the chassis3U VITA 62 compliant universal AC input 400 watt 6 channel plug-in or bulkhead mounted power supply for air or conduction cooled OpenVPX systems. Mercury envisions, creates, and delivers innovative technology solutions purpose-built to meet their customers. Our expertise also includes VITA 66,. Level 5 Rugged Conduction Cooled. Form Factor: VPX Size: 3UConduction cooled at card edge (Air Flow Over available) Conformal coating on PWB; 6U VPX VITA 62 High Power Supplies with Auxiliary voltage. Usually the test adapter includes fields for voltage and amp, current measurements and in some cases also some pins for wire wrap to conduct custom. 6"W x 9. 125 Gb/sec. Conduction-Cooled Option. This system. ,Ltd. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. The 3U VPX backplane uses standard 1. Up to 20 CFM of airflow is provided per slot. 1. This efficient thermal design allows up to 60 W of. Controlled impedance rigid-flex-rigid design. 2) modules. 0 in. Air flow from bottom to top (Other options available on request) Standard 3U rear transition module. or 1. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Part of our 1400 Series of conduction cooled enclosures with air assist, the 1440 is designed to maintain safe operating temperatures for high slot count 3U VPX systems and may be used as a deployment or development chassis. ca. Products. View product. XMC Adapter for 3U OpenVPX This electronics assembly can be damaged by ESD. 5-3- Two 4-lane PCIe fabric ports Power <15W Linux ® and WindRiver VxWorks BSPs Pin compatible with VPX3-131, VPX3-133 and VPX3-1257 Designed for harsh environment applications, both air-cooled and conduction-cooled Introduction Curtiss-Wright Defense Solutions' VPX3-This development chassis enables shortened design cycles for faster time to deployment. The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. CCE-3VX4 Conduction Cooled Enclosure for 3U Modules › 4 slots of 3U VPX on 1" pitch (Open VPX Ready) › Integrated power supply › RuSH enhanced power supply actively monitors: – Voltage on each power rail – Current on each power rail – Temperature (humidity – optional) › FFM-overlay backplane interconnection for quick turn˚Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module The XPand1202 provides a low-cost, flexible, VITA 67 development platform. Works With: Subracks; Cases. As module power continues to increase, however, VITA 48. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. 2 based. pitch without solder-side cover (optional) 1. 2 conduction cooled modules and VITA 67. 0 in. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. The internal SATA SSD memory modules combine the convenience of high-capacity off-the-shelf storage with the reliability of solid-state non-volatile memory. View. LOWER RISK. VStream-VPX Datasheet Order Enquiry for VStream-VPX. 62H. 2) VPX router serves as an aggregation point for on-demand network connectivity in mobile or fixed deployments. The XChange3001 is a 3U VPX-REDI carrier module supporting a single-width XMC card. The development kit includes the cables needed to connect the XPand6200. VPX hold up power supply is a type of power supply used in high-performance computing applications. View product. Hartmann Electronic VPX Standard Chassis are designed to allow any COTS or customer spec configuration in either 3U or 6U form factor taking into account a wide range of. The XChange3012 is a conduction- or air-cooled 3U VPX module that provides both PCI Express and Ethernet switches. Continuous 580W output over temperature range of-40C to +85C. or 1. The XPand1303 is a low-cost, flexible, development platform. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. FEATURES. Higher conduction means lower component temperatures . A ternary biochar/vanadium pentoxide/graphite like carbon nitride (BC/V2O5/g-C3N4 denoted BC/VO/CN) composite was prepared by a simple hydrothermal method and its. Conduction Cooled Industrial-40°C +70°C-55°C +100°C: Operating Humidity Range: Up to 95% (non-condensing) EMC: FCC 47CFR Part 2 EN55022:2010 Equipment ClassB. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. or 1. 2 • 3U or 6U configurationsANSI/VITA 48. Built with aero-grade aluminum, the chassis are suitable for rugged onboard/mobile applications and can operate under extreme temperatures, dust and humidity. com 30765 Wixom Rd, Wixom, MI 48393 USA INTRODUCTION TO VPX: VITA 46, 48, AND 65: THE NEXT GEN VME SYSTEM REPLACEMENT 4The V1160 is built from the ground up for rugged and harsh environments. . This extensive line includes conduction cooled VPX, air cooled VPX, as well as VPX ATR configurations. Systems Integration Plus, Inc. LOWER RISK. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). 8 Live NTSC/PAL/RS-170 video inputs; 4 x Audio input; 8 x D1 size capture at full frame rate; Conduction cooled 3U VPX module; Overlay frame grabber PAL RS-170 NTSC video capture OpenVPX VPX. Download. Input: 80 to 264V AC. OC-CC-VPX-3U-5HP-SS-300-LB48 WT ASSY # - 43094 3U VITA 48. The XPedite6101 provides a compact and cost-effective rugged computing solution with excellent processing performance-per-watt. Verifies chassis can meet power requirement and specifications for VPX. Block Diagram. Description. Conduction-Cooled Option. Two-Slot 6U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. All offers are typically available for. The XPand1203 is a low-cost, flexible, development platform. They are low-power system-on-chip (SoC. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O. The XPand1007 system is a low-cost development platform for conduction-cooled 3U VPX cards. The ICE-Lok® thermally enhanced Wedge. It is available in commercial air-cooled and ruggedised versions up to and including conduction cooling. 85 and 1 in. VITA. Accessories. Accessories Documentation Block Diagram The XPand1004 system is a low-cost development platform forconduction-cooled 3U VPX cards. Both are designed to support a minimum of ten 0. 2 / VPX conduction cooled thermal load board module. 65 in. VPX Backplane, 3 U, 5 Slots, Full-Mesh, Without RTM. Real-time video feedback for remote platforms ; Unmanned vehicles (UAV, ROV) Real-time IP video distribution. Five slots 3U VPX conduction cooled Chassis. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. 8 in. operatiNG temperature 0°C to +55°C Air-Cooled; -40° to +85°C Conduction-Cooled staNDarDs Open VPX MOD3-SWH-2F24U module usable in SLT3-SWH-2F24U-14. 1connectors not included 119EXT6024-06XXR 6U VPX Extender 6U - P0 utility, P1, P3 to P6 differential, P2 single ended 119EXT6024-05XXR 6U VPX Extender 6U - P0 utility, P1 to P6 differentialIt includes the complete connector complement under the standard thus enabling streamlined testing of target payloads. 0 in. or 1. 0 inch pitch. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. MIL-STD-704F compliant except 50mSec holdup provided by separate module. VX3060-S2 Rugged Conduction cooled version is a Plug-in unit according to VITA 48. Available in fixed or removable configurations, with high performance PCIe/NVMe or low power SATA interfaces, and in air cooled or conduction cooled modules. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. A network-attached Flyable Data Loader (FDL). 0 in. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. 2. It provides an easy way to integrate switched mezzanine cards into modern VPX backplanes. 88 in. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. 4-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. 8 in. 8 in. Conduction cooled 3U VPX module; Mechanical. Software. pitch air-cooled VPX (VITA 48. The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. 6-slot, 3U OpenVPX (VITA 65) backplane, 1-in pitch. Up to four power supplies can be paralleled to increase. 2 conduction cooled modules because of their established deployment track record. Front Panel: 2x 10G SFP+. An AFT heat frame includes a closed duct, which is embedded with fins. Part of our AoC3u-600 Series of rugged packaging solutions, the AoC3U-610 is an ATR chassis designed to maintain safe operating temperatures for high power 3U VPX and SOSA aligned conduction cooled systems. 5, air flow-through, which has the advantage of being able to meter the air to specific cards. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. In a VITA 48. The new cooling standard defines design requirements for platforms that need high performance processing, graphics. This allows for all the slots to be on the same non-blocking Ethernet switch instead of two switches chained. comThe VTX994 is a single slot 6U VPX chassis for board bring-up and testing of conduction cooled 6U VPX modules. CCE-3VX1 3U VPX 1-slot CUBE Conduction Cooled; CCE-3VX2 3U VPX 2-slot CUBE Conduction Cooled; CCE-3VX3 3U VPX 3-slot CUBE Conduction Cooled; CCE-3VX4 3U VPX 4-slot CUBE Conduction Cooled; CCE-3VX5 3U VPX 5-slot CUBE Conduction Cooled; CCE-3VX6 3U VPX 6-slot CUBE Conduction Cooled; DEV-4117 Hybrid. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. 3 to the P15 connector for interfacing with the host module. FPGA BSP (FBSP) High-Speed Links (HYDRA) Advanced Board Management Controller (aBMC) Highlights. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. Conduction-cooled, rugged 3U VPX form factor. 2 mechanical format. VPX Extender Cards Product Datasheet. 2: Mechanical Specifications for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX. 11 & VITA 62. This system supports standard SBC and switch modules, as well as VITA 67 modules, making it the ideal platform for high-performance RF applications. The Chassis Manager is VITA 46. These Single Board Computers from X-ES are available in air-cooled and conduction-cooled versions to support a wide variety of. Length: 160 mm. The heat from the internal conduction-cooled modules is. 3V, 5V, +12V_Aux,State of the Art Power Technology VPX Power Supply. Login. Quick. 2 / VPX conduction cooled thermal load board module. 52 in. This platform supports up to eight 0. 2 (REDI) and VITA 65 (OpenVPX™). Supported ruggedization levels (see the X-ES. AT-VPX-PMC/XMC-CAR is one of a family of modules to employ open architecture VITA 46 standard primarily to marry High Speed Interconnect such as Rapid IO and PCI Express. 2 -40°C to 85°C (Rugged Conduction Cooled)Dawn’s VPX Development System for 3U OpenVPX boards aligns well with the requirements specified within Draft 1. 0 Serial: 2 RS-232/422/485 SATA: 6 eSATA. A hybrid switch with 24 ports 32 lane PCI Express Gen 1 / Gen 2 and additional 9 port Gigabit Ethernet switching capabilities provides for highest bandwidth. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. 0 Ruggedized Enhanced Design Implementation. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. January 3rd, 2021. Hover over a product and select Compare to add to comparison set. 625 IN : Model Number:2. The logic-optimized FPGA is well-suited. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. NXP (formerly Freescale) QorIQ P2020 Dual-Core Processor-Based Conduction- or Air-Cooled 3U VPX-REDI Single Board Computer. Contact factory for appropriate board configuration based on environmental requirements. Air, Conduction. The PCIe and Gigabit Ethernet fabrics provide switching for a star topology. Max 10. Signal rate: 3. VITA 62 power connector. 6U, 1 inch pitch form factor. Development chassis for VPX and SOSA aligned module payloads. Frame has injector/ejector latches for plug-in card. Conduction cooled at card edge (Air Flow Through or Air Flow Over available) Conformal coating on PWB; 3U VPX. Desk-top chassis for 6U VPX cards (WxDxH: 350x435x593mm) For five front cards and RTMs with a card width of up to 1. 9 PMC/XMC/Ethernet Signal Mapping to 3U/6U VPX VITA 46. 7W. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. LXH0000523: VPX 3U Load Board - Air cooled: NA. The sensor platform is based on a 3U, 5-slot, conduction-cooled VPX chassis that houses two Eclipse RXR6322 or RXR6332 receivers, one REF6301 GPS-based reference, one Intel Corei7-based single board computer, and a plug-in. Elma’s conduction cooled power supply modules are designed to meet the requirements of VITA 62 for use in harsh environments. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. Single Slot 3U VPX Board Features • Largest available capacity in a single 3U VPX slot with dual SATA drives o Compliant with OpenVPXTM (VITA 65). 2 for conduction cooling • VITA 46 board connectors • IEEE 1101. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). Specification Ordering Information Related Products Resources Summary The ADC-VPX3-XMC is a single XMC carrier for VPX based systems. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. "The conduction cooled 3U VPX CUBE is extremely rugged and reliable for military and aerospace applications where system size, weight, and power are critical, and high performance capability is demanded," says Barry Burnsides, Dawn VME Products Founder and CEO. Product Features. See the Rugged section for more details. This platform supports up to eight 0. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. 6"W x 9. Compare. The XPand1015 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. 3U and 6U VPX mass storage module using the latest NVMe and SATA SSDs. The modules can be easily tailored to suit individual requirements,VPX Test Adapter. The DK3 for 3U VPX features an open frame concept and enhanced flexibility, with fast conversion between air and conduction cooled module guides. Form Factor: Custom Chassis Type: Custom. View. Boards are inserted in the back of the chassis in a vertical orientation. . -50°C to +100°C Relative Humidity 95% non-condensing Altitude 60,000 feet, operating Power Consumption 52. (L) x 4. Conduction- or Air-Cooled 3U VPX-REDI XMC/PMC Carrier Card. 0 in.